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d a t a sh eet objective speci?cation file under integrated circuits, ic01 2001 dec 11 integrated circuits tda8927 power stage 2 80 w class-d audio amplifier
2001 dec 11 2 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 contents 1 features 2 applications 3 general description 4 quick reference data 5 ordering information 6 block diagrams 7 pinning information 8 functional description 8.1 power stage 8.2 protections 8.2.1 overtemperature 8.2.2 short-circuit across the loudspeaker terminals 8.3 btl operation 9 limiting values 10 thermal characteristics 11 quality specification 12 dc characteristics 13 ac characteristics 14 switching characteristics 14.1 duty factor 15 test and application information 15.1 btl application 15.2 remarks 15.3 output power 15.4 reference designs 15.5 reference design bill of material 15.6 curves measured in reference design 16 package outlines 17 soldering 17.1 introduction 17.2 through-hole mount packages 17.2.1 soldering by dipping or by solder wave 17.2.2 manual soldering 17.3 surface mount packages 17.3.1 reflow soldering 17.3.2 wave soldering 17.3.3 manual soldering 17.4 suitability of ic packages for wave, reflow and dipping soldering methods 18 data sheet status 19 definitions 20 disclaimers
2001 dec 11 3 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 1 features high efficiency (>94%) operating voltage from 15 to 30 v very low quiescent current high output power short-circuit proof across the load, only in combination with controller tda8929t diagnostic output usable as a stereo single-ended (se) amplifier or as a mono amplifier in bridge-tied load (btl) electrostatic discharge protection (pin to pin) thermally protected, only in combination with controller tda8929t. 2 applications television sets home-sound sets multimedia systems all mains fed audio systems car audio (boosters). 3 general description the tda8927 is the switching power stage of a two-chip set for a high efficiency class-d audio power amplifier system. the system is split into two chips: TDA8927J/st/th; a digital power stage in a dbs17p, rdbs17p or hsop24 power package tda8929t; the analog controller chip in a so24 package. with this chip set a compact 2 80 w audio amplifier system can be built, operating with high efficiency and very low dissipation. no heatsink is required, or depending on supply voltage and load, a very small one. the system operates over a wide supply voltage range from 15 up to 30 v and consumes a very low quiescent current. 4 quick reference data 5 ordering information symbol parameter conditions min. typ. max. unit general; v p = 25 v v p supply voltage 15 25 30 v i q(tot) total quiescent current no load connected - 35 45 ma h ef?ciency p o =30w - 94 - % stereo single-ended con?guration p o output power r l =4 w ; thd = 10%; v p = 25 v 60 65 - w r l =4 w ; thd = 10%; v p = 27 v 74 80 - w mono bridge-tied load con?guration p o output power r l =4 w; thd = 10%; v p = 17 v 90 110 - w r l =8 w ; thd = 10%; v p = 25 v 120 150 - w type number package name description version TDA8927J dbs17p plastic dil-bent-sil power package; 17 leads (lead length 12 mm) sot243-1 tda8927st rdbs17p plastic rectangular-dil-bent-sil power package; 17 leads (row spacing 2.54 mm) sot577-1 tda8927th hsop24 plastic, heatsink small outline package; 24 leads; low stand-off height sot566-2
2001 dec 11 4 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 6 block diagrams mgw138 handbook, full pagewidth control and handshake driver high TDA8927J tda8927st temperature sensor and current protection driver low temp current 4 7 v ss1 v ss1 v ss2 v dd2 6 1 2 9 810 v dd2 v dd1 13 5 control and handshake driver high driver low 14 11 12 17 16 3 15 en1 diag rel1 sw1 sw2 rel2 powerup en2 boot1 out1 stab out2 boot2 fig.1 block diagram of TDA8927J and tda8927st.
2001 dec 11 5 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 mgw140 handbook, full pagewidth control and handshake driver high tda8927th temperature sensor and current protection 4 driver low temp current 24 17 4 v ss1 v ss1 v ss2 v dd2 3 21 22 6 19 5 8 v dd2 v dd1 11 2 control and handshake driver high driver low 13 9 10 16 15 7 1, 12, 18, 20 23 14 en1 diag rel1 sw1 n.c. v ss(sub) lim sw2 rel2 powerup en2 boot1 out1 stab stab out2 boot2 fig.2 block diagram of tda8927th.
2001 dec 11 6 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 7 pinning information symbol pin description TDA8927J tda8927st tda8927th sw1 1 1 21 digital switch input channel 1 n.c. -- 1 not connected rel1 2 2 22 digital control output channel 1 diag 3 3 23 digital open-drain output for overtemperature and overcurrent report en1 4 4 24 digital enable input for channel 1 v dd1 5 5 2 positive power supply channel 1 boot1 6 6 3 bootstrap capacitor channel 1 stab -- 6 decoupling internal stabilizer for logic supply out1 7 7 4 pwm output channel 1 stab -- 7 decoupling internal stabilizer for logic supply v ss1 8 8 5 negative power supply channel 1 stab 9 9 - decoupling internal stabilizer for logic supply v ss2 10 10 8 negative power supply channel 2 out2 11 11 9 pwm output channel 2 boot2 12 12 10 bootstrap capacitor channel 2 n.c. -- 12 not connected v dd2 13 13 11 positive power supply channel 2 en2 14 14 13 digital enable input for channel 2 powerup 15 15 14 enable input for switching-on internal reference sources rel2 16 16 15 digital control output channel 2 sw2 17 17 16 digital switch input channel 2 lim -- 17 current input for setting maximum load current limit n.c. -- 18 not connected v ss(sub) -- 19 negative supply (substrate) n.c. -- 20 not connected
2001 dec 11 7 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage TDA8927J tda8927st mgw142 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 v ss1 v ss2 v dd2 v dd1 en1 diag rel1 sw1 sw2 rel2 powerup en2 boot1 out1 stab out2 boot2 fig.3 pin configuration of TDA8927J and tda8927st. handbook, halfpage en1 diag rel1 sw1 n.c. v ss(sub) n.c. lim sw2 rel2 powerup en2 n.c. v dd1 boot1 out1 stab stab v ss1 v ss2 out2 boot2 v dd2 n.c. 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 tda8927th mgw144 fig.4 pin configuration of tda8927th.
2001 dec 11 8 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 8 functional description the combination of the TDA8927J and the tda8929t produces a two-channel audio power amplifier system using the class-d technology (see fig.5). in the tda8929t controller device the analog audio input signal is converted into a digital pulse width modulation (pwm) signal. the power stage tda8927 is used for driving the low-pass filter and the loudspeaker load. it performs a level shift from the low-power digital pwm signal, at logic levels, to a high-power pwm signal that switchs between the main supply lines. a second-order low-pass filter converts the pwm signal into an analog audio signal across the loudspeaker. see the specification of the tda8929t for a description of the controller. 8.1 power stage the power stage contains the high-power dmos switches, the drivers, timing and handshaking between the power switches and some control logic. for protection, a temperature sensor and a maximum current detector are built-in on the chip. for interfacing with the controller chip the following connections are used: switch (pins sw1 and sw2): digital inputs; switching from v ss to v ss + 12 v and driving the power dmos switches release (pins rel1 and rel2): digital outputs to indicate switching from v ss to v ss + 12 v, follows pins sw1 and sw2 with a small delay enable (pins en1 and en2): digital inputs; at a level of v ss the power dmos switches are open and the pwm output is floating; at a level of v ss + 12 v the power stage is operational and controlled by the switch pin if pin powerup is at v ss +12v power-up (pin powerup): must be connected to a continuous supply voltage of at least v ss + 5 v with respect to v ss diagnostics (pin diag): digital open-drain output; pulled to v ss if temperature or maximum current is exceeded. 8.2 protections temperature and short-circuit protection sensors are included in the tda8927 power stage. these protections are only operational in combination with the tda8929t. in the event that the maximum current or maximum temperature is exceeded the diagnostic output is activated. the controller has to take appropriate measures by shutting down the system. 8.2.1 o vertemperature if the junction temperature (t j ) exceeds 150 c, then pin diag becomes low. the diagnostic pin is released if the temperature is dropped to approximately 130 c, so there is a hysteresis of approximately 20 c. 8.2.2 s hort - circuit across the loudspeaker terminals when the loudspeaker terminals are short-circuited it will be detected by the current protection. if the output current exceeds the maximum output current of 7.5 a, then pin diag becomes low. the controller should shut down the system to prevent damage. using the tda8929t the system is shut down within 1 m s, and after 220 ms, it will attempt to restart the system again. during this time the dissipation is very low, so the average dissipation during a short-circuit is practically zero. for the tda8927th the limit value can be externally adjusted using a resistor. for the maximum value of 7.5 a pin lim should be connected to v ss . when a resistor r ext is connected between pin lim and v ss the maximum output current can be set at a lower value, using: example 1: with r ext =27k w the current is limited at 3.8 a. example 2: with r ext =0 w the current is limited at 7.5 a. in the TDA8927J and the tda8927st pin lim is internally connected to v ss , so i o(max) = 7.5 a. i o(max) 2.1 10 5 r ext 28 k w + -------------------------------- - =
2001 dec 11 9 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... handbook, full pagewidth 1 4 in1 - pwm1 5 in1 + in2 + in2 - mute mute sgnd sgnd sgnd1 sgnd2 3 20 rel1 23 sw1 24 en1 rel1 sw1 en1 stab diagcur diagtmp sw2 rel2 pwm2 21 22 19 15 13 en2 sw2 rel2 en2 16 14 17 6 11 8 9 7 2 r fb r fb input stage input stage tda8929t pwm modulator pwm modulator mode stabi stab powerup oscillator manager v ssa v dda v ss1 v dd1 12 10 v ssa v dda v ss2(sub) v ssd v dd2 v mode v ssa mode osc r osc 18 mgu388 diag control and handshake driver high TDA8927J temperature sensor and current protection driver low 2 7 + 25 v - 25 v v ss1 v ss1 v ssa v ss2 v ssd v ddd v dd2 v dda 6 1 4 9 810 v dd2 v dd1 13 5 control and handshake driver high driver low 14 11 12 17 16 3 15 boot1 out1 out2 boot2 sgnd (0 v) v i(1) v i(2) fig.5 typical application schematic of the class-d system using tda8929t and the TDA8927J.
2001 dec 11 10 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 8.3 btl operation btl operation can be achieved by driving the audio input channels of the controller in the opposite phase and by connecting the loudspeaker with a btl output filter between the two pwm output pins of the power stage (see fig.6). in this way the system operates as a mono btl amplifier and with the same loudspeaker impedance a four times higher output power can be obtained. for more information see chapter 15. mgu386 handbook, full pagewidth control and handshake driver high TDA8927J temperature sensor and current protection driver low temp current 4 7 v ss1 v ss1 v ss2 v dd2 6 1 2 9 810 v dd2 v dd1 13 5 control and handshake driver high driver low 14 11 12 17 16 3 15 en1 diag rel1 sw1 sw2 rel2 powerup en2 boot1 out1 stab out2 boot2 sgnd (0 v) fig.6 mono btl application.
2001 dec 11 11 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 9 limiting values in accordance with the absolute maximum rate system (iec 60134). notes 1. human body model (hbm); r s = 1500 w ; c = 100 pf. 2. machine model (mm); r s =10 w ; c = 200 pf; l = 0.75 m h. 10 thermal characteristics 11 quality specification in accordance with snw-fq611-part d if this type is used as an audio amplifier. symbol parameter conditions min. max. unit v p supply voltage - 30 v v p(sc) supply voltage for short-circuits across the load - 30 v i orm repetitive peak current in output pins - 7.5 a t stg storage temperature - 55 +150 c t amb ambient temperature - 40 +85 c t vj virtual junction temperature - 150 c v es(hbm) electrostatic discharge voltage (hbm) note 1 all pins with respect to v dd (class a) - 500 +500 v all pins with respect to v ss (class a1) - 1500 +1500 v all pins with respect to each other (class a1) - 1500 +1500 v v es(mm) electrostatic discharge voltage (mm) note 2 all pins with respect to v dd (class b) - 250 +250 v all pins with respect to v ss (class b) - 250 +250 v all pins with respect to each other (class b) - 250 +250 v symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air TDA8927J 40 k/w tda8927st 40 k/w tda8927th 40 k/w r th(j-c) thermal resistance from junction to case in free air TDA8927J ? 1.0 k/w tda8927st ? 1.0 k/w tda8927th 1 k/w
2001 dec 11 12 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 12 dc characteristics v p = 25 v; t amb =25 c; measured in test diagram of fig.8; unless otherwise speci?ed. notes 1. the circuit is dc adjusted at v p = 15 to 30 v. 2. temperature sensor or maximum current sensor activated. symbol parameter conditions min. typ. max. unit supply v p supply voltage note 1 15 25 30 v i q(tot) total quiescent current no load connected - 35 45 ma outputs ?oating - 510ma internal stabilizer logic supply (pin stab or pins stab1 and stab2) v o(stab) stabilizer output voltage 11 13 15 v switch inputs (pins sw1 and sw2) v ih high-level input voltage referenced to v ss 10 - v stab v v il low-level input voltage referenced to v ss 0 - 2v control outputs (pins rel1 and rel2) v oh high-level output voltage referenced to v ss 10 - v stab v v ol low-level output voltage referenced to v ss 0 - 2v diagnostic output (pin diag, open-drain) v ol low-level output voltage i diag = 1 ma; note 2 0 - 1.0 v i lo leakage output current no error condition -- 50 m a enable inputs (pins en1 and en2) v ih high-level input voltage referenced to v ss - 9v stab v v il low-level input voltage referenced to v ss 05 - v v en(hys) hysteresis voltage - 4 - v i i(en) input current -- 300 m a switching-on input (pin powerup) v powerup operating voltage referenced to v ss 5 - 12 v i i(powerup) input current v powerup =12v - 100 170 m a temperature protection t diag temperature activating diagnostic v diag =v diag(low) 150 -- c t hys hysteresis on temperature diagnostic v diag =v diag(low) - 20 - c
2001 dec 11 13 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 13 ac characteristics notes 1. v p = 25 v; r l =4 w ; f i = 1 khz; t amb =25 c; measured in reference design in figs 9 and 11; unless otherwise specified. 2. indirectly measured; based on r ds(on) measurement. 3. total harmonic distortion (thd) is measured in a bandwidth of 22 hz to 22 khz. when distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. 4. efficiency for power stage; output power measured across the loudspeaker load. 5. v p = 25 v; r l =8 w ; f i = 1 khz; t amb =25 c; measured in reference design in figs 9 and 11; unless otherwise specified. symbol parameter conditions min. typ. max. unit single-ended application; note 1 p o output power r l =4 w ; thd = 0.5%; v p = 25 v 50 (2) 55 - w r l =4 w ; thd = 10%; v p = 25 v 60 (2) 65 - w r l =4 w ; thd = 0.5%; v p = 27 v 60 (2) 65 - w r l =4 w ; thd = 10%; v p = 27 v 74 (2) 80 - w thd total harmonic distortion p o = 1 w; note 3 f i = 1 khz - 0.01 0.05 % f i = 10 khz - 0.1 - % g v(cl) closed-loop voltage gain 29 30 31 db h ef?ciency p o = 30 w; f i = 1 khz; note 4 - 94 - % mono btl application; note 5 p o output power r l =8 w ; thd = 0.5%; v p = 25 v 100 (2) 112 - w r l =8 w ; thd = 10%; v p = 25 v 128 (2) 140 - w r l =4 w ; thd = 0.5%; v p = 17 v 80 (2) 87 - w r l =4 w ; thd = 10%; v p = 17 v 100 (2) 110 - w thd total harmonic distortion p o = 1 w; note 3 f i = 1 khz - 0.01 0.05 % f i = 10 khz - 0.1 - % g v(cl) closed loop voltage gain 35 36 37 db h ef?ciency p o = 30 w; f i = 1 khz; note 4 - 94 - %
2001 dec 11 14 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 14 switching characteristics v p = 25 v; t amb =25 c; measured in fig.8; unless otherwise speci?ed. note 1. when used in combination with the tda8929t controller, the effective minimum pulse width during clipping is 0.5t w(min) . 14.1 duty factor for the practical useable minimum and maximum duty factor ( d ) which determines the maximum output power: 100% < d < 100% using the typical values: 3.5% < d < 96.5%. symbol parameter conditions min. typ. max. unit pwm outputs (pins out1 and out2); see fig.7 t r rise time - 30 - ns t f fall time - 30 - ns t blank blanking time - 70 - ns t pd propagation delay from pin sw to pin pwm - 20 - ns t w(min) minimum pulse width note 1 - 220 270 ns r ds(on) on-resistance of the output transistors - 0.2 0.3 w t w(min) f osc 2 ------------------------------- 1 t w(min) f osc 2 ------------------------------- C ? ??
2001 dec 11 15 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, full pagewidth mgw145 pwm output (v) v dd v ss 0 v t blank t f t r 1/f osc 100 ns v stab v ss v sw (v) t pd v stab v ss v rel (v) fig.7 timing diagram pwm output, switch and release signals.
2001 dec 11 16 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... 15 test and application information a ndbook, full pagewidth 12 k w 15 nf mgw184 15 nf 100 nf control and handshake driver high TDA8927J temperature sensor and current protection driver low temp current 4 7 v ss1 v ss1 v rel2 v ss2 v dd2 6 1 2 9 810 v dd2 v dd1 13 5 control and handshake driver high driver low 14 11 12 17 16 3 15 en1 diag rel1 sw1 sw2 rel2 powerup en2 boot1 2v dd out1 stab out2 v out2 v out1 boot2 12 v v v v v sw2 v rel1 v v sw1 v en 12 v 0 v diag v v stab v 12 v 0 fig.8 test diagram.
2001 dec 11 17 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 15.1 btl application when using the system in a mono btl application (for more output power), the inputs of both channels of the pwm modulator must be connected in parallel; the phase of one of the inputs must be inverted. in principle the loudspeaker can be connected between the outputs of the two single-ended demodulation filters. 15.2 remarks the case of the package of the TDA8927J/st and the heatsink of the tda8927th are internally connected to v ss . 15.3 output power the output power in single-ended applications can be estimated using the formulae: the maximum current should not exceed 7.5 a. the output power in btl applications can be estimated using the formulae: the maximum current should not exceed 7.5 a. where: r l = load impedance r s = series resistance of filter coil p o(1%) = output power just at clipping the output power at thd = 10%: p o(10%) = 1.25 p o(1%) . 15.4 reference designs the reference design for a two-chip class-d audio amplifier for tda8926j or TDA8927J and tda8929t is shown in fig.9. the printed-circuit board (pcb) layout is shown in fig.10. the bill of materials is given in table 1. the reference design for a two-chip class-d audio amplifier for tda8926th or tda8927th and tda8929t is shown in fig.11. the pcb layout is shown in fig.12. p o(1%) r l r l r ds(on) r s ++ () ------------------------------------------------ v p 1t w(min) f osc C () 2 2r l -------------------------------------------------------------------------------------------------------------------------- = i o(max) v p 1t w(min) f osc C () [] r l r ds(on) r s ++ ---------------------------------------------------------------- = p o(1%) r l r l 2r ds(on) r s + () + --------------------------------------------------------- - 2v p 1t w(min) f osc C () 2 2r l ------------------------------------------------------------------------------------------------------------------------------- -------- - = i o(max) 2v p 1t w(min) f osc C () [] r l 2r ds(on) r s + () + -------------------------------------------------------------------- - =
2001 dec 11 18 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... handbook, full pagewidth mld633 39 k w r19 39 k w r7 10 k w 220 nf c2 r20 1 k w r10 sumida 33 m h cdrh127-330 l4 sumida 33 m h cdrh127-330 l2 gnd 220 nf c44 220 nf c1 3 6 17 pwm2 5 4 8 9 10 12 15 n.c. 1 1 nf c29 input 2 input 1 j5 j6 d1 (5.6 v) d2 (7.5 v) in1 + in1 - gnd 2 11 sgnd1 sgnd2 s1 v ssa v ss1 v ss2 v dda v dd2 v dd1 gnd 1 2 1 2 1 2 qgnd qgnd qgnd qgnd out1 - out1 + out1 + out2 - out2 - out2 + boot2 boot1 out1 out2 v ddd v dd1 v dd2 v ss2 v ss1 v ddd v ssd v ssa v ssd 27 k w r1 7 220 nf c3 osc powerup v ssa 220 nf c5 mode v dda r24 200 k w v ddd on mute off u2 tda8929t controller c22 330 pf c27 470 nf c4 220 nf c7 220 nf c14 470 nf c18 1 nf c19 1 nf c20 1 nf c21 1 nf c16 470 nf c6 220 nf c9 15 nf c8 15 nf c43 180 pf in2 + in2 - r6 10 k w c26 470 nf r4 10 k w 1 nf c28 c24 470 nf r5 10 k w j3 j1 qgnd qgnd inputs outputs power supply mode select j4 j2 v ss c25 470 nf c23 330 pf r11 5.6 w c10 560 pf v ssd v ddd v ssd r12 5.6 w r13 5.6 w r14 5.6 w c11 560 pf c12 560 pf c13 560 pf r22 9.1 k w v ssd v ssa v dda v ddd c31 1 nf c30 1 nf c33 220 nf c35 1500 m f (35 v) r21 10 k w c32 220 nf c34 1500 m f (35 v) c38 220 nf c39 220 nf c41 47 m f (35 v) c36 220 nf c37 220 nf c40 47 m f (35 v) gnd qgnd qgnd bead l6 l5 bead l7 bead gnd v dd v ss + 25 v - 25 v 1 2 3 13 sw2 14 rel2 16 en2 sw2 rel2 en2 21 pwm1 23 sw1 24 15 9 3 u1 tda8926j or TDA8927J power stage 17 16 14 4 2 1 8 10 13 5 6 7 11 12 rel1 20 en1 sw1 rel1 en1 19 stab stab 18 v ssd 22 diagcur diag r16 24 w r15 24 w 4 or 8 w se 4 or 8 w se 8 w btl c17 220 nf c15 220 nf fig.9 two-chip class-d audio amplifier application diagram for tda8926j or TDA8927J and tda8929t. r21 and r22 are only necessary in btl applications with asymmetrical supply. btl: remove r6, r7, c23, c26 and c27 and close j5 and j6. c22 and c23 influence the low-pass frequency response and should be tuned with the real load (loudspeaker). inputs floating or inputs referenced to qgnd (close j1 and j4) or referenced to v ss (close j2 and j3) for an input signal ground reference.
2001 dec 11 19 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... ha ndbook, full pagewidth mld634 c24 d1 tda8926j/27j & tda8929t copper top, top view copper bottom, top view silk screen top, top view silk screen bottom, top view d2 l7 l5 in1 gnd in2 out1 out2 state of d art version 21 03-2001 u1 c25 c34 c35 c40 c26 c27 l6 on mute off c41 c16 c14 s1 r20 r1 r21 l2 l4 r22 c38 u2 c39 c36 r24 r5 r4 r6 r7 c2 c31 c30 c18 c19 c20 c21 c1 c9 c8 j4 j5 j6 j1 j3 j2 r19 c13 c33 c32 c11 c29 c28 r14 r12 c3 c43 r10 c12 c17 r16 c15 r15 r13 r11 c10 c5 c37 c22 c23 c44 v dd v ss in1 out1 out2 gnd in2 qgnd v dd v ss c7 c4 c6 fig.10 printed-circuit board layout for tda8926j or TDA8927J and tda8929t.
2001 dec 11 20 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... handbook, full pagewidth mgw232 39 k w r1 30 k w r7 10 k w 100 nf c12 r2 1 k w r8 5.6 w r11 sumida 33 m h cdrh127-330 l4 sumida 33 m h cdrh127-330 l2 l1 bead l3 bead gnd 100 nf c1 220 nf c11 3 6 17 pwm2 5 4 8 9 10 12 15 n.c. 1 1 nf c10 input 2 input 1 j5 j6 d1 (5.6 v) in1 + in1 - gnd 2 11 sgnd1 sgnd2 s1 v ssa v ssd v ss1 v ss2 v dda v dd2 v dd1 gnd 1 2 1 2 1 2 qgnd qgnd qgnd qgnd out1 - out1 + out1 + out2 - out2 - out2 + boot2 boot1 out1 out2 v ddd v dd1 v dd2 v ss2 v ss1 v ddd v ssd v ssa v ssd 27 k w r3 7 220 nf c2 osc powerup v ssa 100 nf c14 mode v dda r18 200 k w d2 (7.5 v) v ddd on mute off u2 tda8929t controller c3 330 pf c8 1 m f c13 100 nf c27 100 nf c36 470 nf c40 1 nf c41 1 nf c42 1 nf c43 1 nf c37 470 nf c28 100 nf c33 15 nf c26 15 nf c15 180 pf in2 + in2 - r6 10 k w c7 1 m f r5 10 k w 1 nf c9 c6 1 m f r4 10 k w j3 j1 qgnd qgnd inputs outputs power supply mode select j4 j2 v ss c5 1 m f c4 330 pf r12 5.6 w c24 560 pf v ssd v ddd v ssd r13 5.6 w r14 5.6 w r15 5.6 w c25 560 pf c34 560 pf c35 560 pf r10 9.1 k w v ssd v ssa v dda v ddd c17 1 nf c16 1 nf r9 10 k w c20 100 nf c21 100 nf c23 47 m f (35 v) c18 100 nf c19 100 nf c22 47 m f (35 v) gnd qgnd qgnd qgnd bead l6 l5 bead l7 bead gnd c30 100 nf c32 1500 m f (35 v) c29 100 nf c31 1500 m f (35 v) v dd v ss + 25 v - 25 v 1 2 3 13 sw2 14 rel2 16 en2 sw2 rel2 en2 21 pwm1 23 sw1 24 14 6 23 u1 tda8926th or tda8927th power stage 16 15 13 24 22 21 5 8 11 2 3 4 9 10 rel1 20 en1 sw1 rel1 en1 19 stab stab 19 v ss(sub) v ssd 17 lim v ssd 7 stab 18 22 diagcur diag r17 5.6 w r16 5.6 w 4 or 8 w se 4 or 8 w se 8 w btl c39 220 nf c38 220 nf 1, 12, 18, 20 n.c. fig.11 two-chip class-d audio amplifier application diagram for tda8926th or tda8927th and tda8929t. r9 and r10 are only necessary in btl applications with asymmetrical supply. btl: remove r6, r7, c4, c7 and c8 and close j5 and j6. demodulation coils l2 and l4 should be matched in btl. inputs floating or inputs referenced to qgnd (close j1 and j4) or referenced to v ss (close j2 and j3).
2001 dec 11 21 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... d book, full pagewidth mgw147 tda8926th/27th tda8929t copper top, top view copper bottom, top view silk screen top, top view silk screen bottom, top view in1 in2 state of d art on mu off s1 l4 l3 c31 c32 c22 d1 c23 c37 c36 l6 version 2cth1 l5 l1 c29 c2 c9 c10 c8 c7 r4 r5 r7 r6 r3 c30 c35 c1 c15 c12 c21 j6 j5 c19 c13 l7 c3 c4 c5 c6 c18 c11 r11 c20 r8 r1 r2 c14 r12 r14 r13 r17 r16 r10 r9 c39 c43 j4 j2 j3 j1 qgnd c42 c41 c40 c16 c17 c38 r15 c25 c24 c34 c26 c33 jan 2001 u1 u2 c27 c28 l5 gnd out1 out2 v dd v ss fig.12 printed-circuit board layout for tda8926th or tda8927th and tda8929t.
2001 dec 11 22 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 15.5 reference design bill of materials table 1 two-chip class-d audio ampli?er pcb (version 2.1; 03-2001) for tda8926j or TDA8927J and tda8929t (see figs 9 and 10) component description value comments in1 and in2 cinch input connectors 2 farnell: 152-396 out1, out2, v dd , gnd and v ss supply/output connectors 2 augat 5kev-02; 1 augat 5kev-03 s1 on/mute/off switch pcb switch knitter at e 1 e m-o-m u1 power stage ic tda8926j/27j dbs17p package u2 controller ic tda8929t so24 package l2 and l4 demodulation ?lter coils 33 m h2 sumida cdrh127-330 l5, l6 and l7 power supply ferrite beads 3 murata bl01rn1-a62 c1 and c2 supply decoupling capacitors for v dd to v ss of the controller 220 nf/63 v 2 smd1206 c3 clock decoupling capacitor 220 nf/63 v smd1206 c4 12 v decoupling capacitor of the controller 220 nf/63 v smd1206 c5 12 v decoupling capacitor of the power stage 220 nf/63 v smd1206 c6 and c7 supply decoupling capacitors for v dd to v ss of the power stage 220 nf/63 v smd1206 c8 and c9 bootstrap capacitors 15 nf/50 v 2 smd0805 c10, c11, c12 and c13 snubber capacitors 560 pf/100 v 4 smd0805 c14 and c16 demodulation ?lter capacitors 470 nf/63 v 2 mkt c15 and c17 resonance suppress capacitors 220 nf/63 v 2 smd1206 c18, c19, c20 and c21 common mode hf coupling capacitors 1 nf/50 v 4 smd0805 c22 and c23 input ?lter capacitors 330 pf/50 v 2 smd1206 c24, c25, c26 and c27 input capacitors 470 nf/63 v 4 mkt c28, c29, c30 and c31 common mode hf coupling capacitors 1 nf/50 v 2 smd0805 c32 and c33 power supply decoupling capacitors 220 nf/63 v 2 smd1206 c34 and c35 power supply electrolytic capacitors 1500 m f/35 v 2 rubycon zl very low esr (large switching currents) c36, c37, c38 and c39 analog supply decoupling capacitors 220 nf/63 v 4 smd1206 c40 and c41 analog supply electrolytic capacitors 47 m f/35 v 2 rubycon za low esr c43 diagnostic capacitor 180 pf/50 v smd1206 c44 mode capacitor 220 nf/63 v smd1206 d1 5.6 v zener diode bzx79c5v6 do-35 d2 7.5 v zener diode bzx79c7v5 do-35 r1 clock adjustment resistor 27 k w smd1206
2001 dec 11 23 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 r4, r5, r6 and r7 input resistors 10 k w 4 smd1206 r10 diagnostic resistor 1 k w smd1206 r11, r12, r13 and r14 snubber resistors 5.6 w ; >0.25 w 4 smd1206 r15 and r16 resonance suppression resistors 24 w 2 smd1206 r19 mode select resistor 39 k w smd1206 r20 mute select resistor 39 k w smd1206 r21 resistor needed when using an asymmetrical supply 10 k w smd1206 r22 resistor needed when using an asymmetrical supply 9.1 k w smd1206 r24 bias resistor for powering-up the power stage 200 k w smd1206 component description value comments 15.6 curves measured in reference design handbook, halfpage 10 2 10 1 10 - 1 10 - 3 10 - 2 mld627 10 - 2 10 - 1 1 p o (w) thd + n (%) 10 10 2 10 3 (1) (2) (3) fig.13 thd + n as a function of output power. 2 8 w se; v p = 25 v: (1) 10 khz. (2) 1 khz. (3) 100 hz. handbook, halfpage mld628 10 10 2 10 3 10 4 10 5 10 2 10 1 10 - 1 10 - 3 10 - 2 f i (hz) thd + n (%) (1) (2) fig.14 thd + n as a function of input frequency. 2 8 w se; v p = 25 v: (1) p o =10w. (2) p o =1w.
2001 dec 11 24 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage 10 2 10 1 10 - 1 10 - 3 10 - 2 mld629 10 - 2 10 - 1 1 p o (w) thd + n (%) 10 10 2 10 3 (1) (2) (3) fig.15 thd + n as a function of output power. 2 4 w se; v p = 25 v: (1) 10 khz. (2) 1 khz. (3) 100 hz. fig.16 thd + n as a function of output power. handbook, halfpage mld630 10 10 2 10 3 10 4 10 5 10 2 10 1 10 - 1 10 - 3 10 - 2 f i (hz) thd + n (%) (1) (2) fig.16 thd + n as a function of input frequency. 2 4 w se; v p = 25 v: (1) p o =10w. (2) p o =1w. handbook, halfpage 10 2 10 1 10 - 1 10 - 3 10 - 2 mld631 10 - 2 10 - 1 1 p o (w) thd + n (%) 10 10 2 10 3 (1) (2) (3) fig.17 thd + n as a function of output power. 1 8 w btl; v p = 25 v: (1) 10 khz. (2) 1 khz. (3) 100 hz. handbook, halfpage mld632 10 10 2 10 3 10 4 10 5 10 2 10 1 10 - 1 10 - 3 10 - 2 f i (hz) thd + n (%) (1) (2) fig.18 thd + n as a function of input frequency. 1 8 w btl; v p = 25 v: (1) p o =10w. (2) p o =1w.
2001 dec 11 25 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage 0 25 5 10 15 20 mld609 10 - 2 10 - 1 1 (2) p o (w) p (w) 10 10 2 10 3 (1) (3) fig.19 power dissipation as a function of output power. v p = 25 v; f i = 1 khz: (1) 2 4 w se. (2) 1 8 w btl. (3) 2 8 w se. handbook, halfpage 0 (3) (1) (2) 150 100 0 20 40 60 80 30 h (%) p o (w) 60 90 120 mld610 fig.20 efficiency as a function of output power. v p = 25 v; f i = 1 khz: (1) 2 4 w se. (2) 1 8 w btl. (3) 2 8 w se. handbook, halfpage 10 (3) (4) (1) (2) 35 200 0 40 80 120 160 15 p o (w) v p (v) 20 25 30 mld611 fig.21 output power as a function of supply voltage. thd+n= 0.5%; f i = 1 khz: (1) 1 4 w btl. (2) 1 8 w btl. (3) 2 4 w se. (4) 2 8 w se. handbook, halfpage 10 (3) (4) (1) (2) 35 200 0 40 80 120 160 15 p o (w) v p (v) 20 25 30 mld612 fig.22 output power as a function of supply voltage. thd + n = 10%; f i = 1 khz: (1) 1 4 w btl. (2) 1 8 w btl. (3) 2 4 w se. (4) 2 8 w se.
2001 dec 11 26 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage - 100 0 - 80 - 60 - 40 - 20 mld613 10 2 10 f i (hz) a cs (db) 10 3 10 4 10 5 (1) (2) fig.23 channel separation as a function of input frequency. 2 8 w se; v p = 25 v: (1) p o =10w. (2) p o =1w. handbook, halfpage - 100 0 - 80 - 60 - 40 - 20 mld614 10 2 10 f i (hz) a cs (db) 10 3 10 4 10 5 (1) (2) fig.24 channel separation as a function of input frequency. 2 4 w se; v p = 25 v: (1) p o =10w. (2) p o =1w. handbook, halfpage 20 45 25 30 35 40 mld615 10 2 10 f i (hz) g (db) 10 3 10 4 10 5 (1) (2) (3) fig.25 gain as a function of input frequency. v p = 25 v; v i = 100 mv; r s =10k w /c i = 330 pf: (1) 1 8 w btl. (2) 2 8 w se. (3) 2 4 w se. handbook, halfpage 20 45 25 30 35 40 mld616 10 2 10 f i (hz) g (db) 10 3 10 4 10 5 (1) (2) (3) fig.26 gain as a function of input frequency. v p = 25 v; v i = 100 mv; r s =0 w : (1) 1 8 w btl. (2) 2 8 w se. (3) 2 4 w se.
2001 dec 11 27 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage - 100 0 - 80 - 60 - 40 - 20 mld617 10 2 10 f i (hz) svrr (db) 10 3 10 4 10 5 (1) (2) (3) fig.27 svrr as a function of input frequency. v p = 25 v; v ripple = 2 v (p-p) with respect to gnd: (1) both supply lines in anti-phase. (2) both supply lines in phase. (3) one supply line rippled. handbook, halfpage 05 0 - 100 - 80 - 60 - 40 - 20 1 (1) (3) svrr (db) v ripple (v) 234 mld618 (2) fig.28 svrr as a function of v ripple (p-p). v p = 25 v; v ripple with respect to gnd: (1) f ripple = 1 khz. (2) f ripple = 100 hz. (3) f ripple =10hz. handbook, halfpage 0102030 v p (v) i q (ma) 37.5 100 0 20 40 60 80 mld619 fig.29 quiescent current as a function of supply voltage. r l = open. handbook, halfpage 0102030 v p (v) f clk (khz) 40 380 340 348 356 364 372 mld620 fig.30 clock frequency as a function of supply voltage. r l = open.
2001 dec 11 28 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage 0 5 1 2 3 4 mld621 10 - 1 10 - 2 p o (w) v ripple (v) 11010 2 (1) (2) fig.31 supply voltage ripple as a function of output power. v p = 25 v; 1500 m f per supply line; f i =10hz: (1) 1 4 w se. (2) 1 8 w se. handbook, halfpage 5 0 10 10 4 mld622 10 2 10 3 f i (hz) svrr (%) 1 2 3 4 (1) (2) fig.32 svrr as a function of input frequency. v p = 25 v; 1500 m f per supply line: (1) p o = 30 w into 1 4 w se. (2) p o = 15 w into 1 8 w se. handbook, halfpage 600 100 (3) f clk (khz) thd + n (%) 200 300 400 500 10 1 10 - 1 10 - 2 10 - 3 mld623 (1) (2) fig.33 thd + n as a function of clock frequency. v p = 25 v; p o = 1 w in 2 8 w : (1) 10 khz. (2) 1 khz. (3) 100 hz. handbook, halfpage 100 600 50 0 10 20 30 40 200 p o (w) f clk (khz) 300 400 500 mld624 fig.34 output power as a function of clock frequency. v p = 25 v; r l =2 8 w ; f i = 1 khz; th d+n= 10%.
2001 dec 11 29 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 handbook, halfpage 100 600 150 0 30 60 90 120 200 i q (ma) f clk (khz) 300 400 500 mld625 fig.35 quiescent current as a function of clock frequency. v p = 25 v; r l = open. handbook, halfpage 100 600 1000 0 200 400 600 800 200 v r(pwm) (mv) f clk (khz) 300 400 500 mld626 fig.36 pwm residual voltage as a function of clock frequency. v p = 25 v; r l =2 8 w .
2001 dec 11 30 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 16 package outlines references outline version european projection issue date iec jedec eiaj dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot243-1 0 5 10 mm scale d l e a c a 2 l 3 q w m b p 1 d d z e e x h 117 j e h non-concave 97-12-16 99-12-17 dbs17p: plastic dil-bent-sil power package; 17 leads (lead length 12 mm) sot243-1 view b : mounting base side m 2 e v m b unit a e 1 a 2 b p cd (1) e (1) z (1) de d h ll 3 m mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 v 0.8 12.2 11.8 1.27 e 2 5.08 2.4 1.6 e h 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 12.4 11.0 q j 0.4 w 0.03 x
2001 dec 11 31 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 unit a e 1 e 2 a 2 b p ce (1) d (1) z (1) de ll 1 references outline version european projection issue date iec jedec eiaj mm 13.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 1.27 2.54 4.7 4.1 e h d h 6 2.00 1.45 2.1 1.8 3.4 3.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 4.7 4.1 sot577-1 0 5 10 mm scale q j 0.4 w 0.6 v 0.03 x d e a l 1 q l c a 2 w m b p 1 d z e 2 e e 117 j 00-01-19 00-03-15 rdbs17p: plastic rectangular-dil-bent-sil power package; 17 leads (row spacing 2.54 mm) sot577-1 v m d x h e h non-concave view b : mounting base side b
2001 dec 11 32 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 unit a 4 (1) references outline version european projection issue date 00-03-24 iec jedec eiaj mm + 0.12 - 0.02 3.5 0.35 dimensions (mm are the original dimensions) notes 1. limits per individual lead. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot566-2 0 5 10 mm scale hsop24: plastic, heatsink small outline package; 24 leads; low stand-off height sot566-2 a max. detail x a 2 3.5 3.2 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.7 1.5 2.7 2.2 v 0.25 w 0.25 yz 8 0 q 0.07 x 0.03 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1.0 d (2) 16.0 15.8 e (2) 11.1 10.9 0.53 0.40 a 3 a 4 a 2 (a 3 ) l p q a q d y x h e e c v m a x a b p w m z d 1 d 2 e 2 e 1 e 24 13 1 12 pin 1 index
2001 dec 11 33 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 17 soldering 17.1 introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. 17.2 through-hole mount packages 17.2.1 s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.2.2 m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. 17.3 surface mount packages 17.3.1 r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. 17.3.2 w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.3.3 m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2001 dec 11 34 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 17.4 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, hbga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable -
2001 dec 11 35 philips semiconductors objective speci?cation power stage 2 80 w class-d audio ampli?er tda8927 18 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. 19 definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2001 sca73 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 753503/01/pp 36 date of release: 2001 dec 11 document order number: 9397 750 08191

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